Dust Prevention Technology

Features

  • When carrying out forming operations using a typical press die, the edges of the printed circuit board generate dust, causing fluffiness and burrs as well as cracks to form. Satosen liberally utilizes high-precision punching & die and machine molding, unique die heat processing/surface treatment and high-precision assembly technology, far surpassing traditional press dies and achieving results very close to that of router machining. When carrying out surface configuration with normal dies, fluffiness and burrs, as well as cracks form on the edges of the printed circuit board. Satosen make liberal use of high-precision punching and die and machine molding, unique die heat processing/surface treatment and high-precision assembly technology, far surpassing traditional press dies and achieving a finish very close to that of router machining.

A finish very close to that of router machining⇒Contouring with dies that prevent the generation of dust