

| Thickness of board | Rigid portion 1.4 mm |
|---|---|
| Guaranteed Number of bending | 5 times |
| Plating | Electric and bondable Gold (min Ni5 microns,Au 0.3 microns) |
| Bonding strength | >7g (Can supply test report) |
| Heat radiation | Copper core, Heat sink pin |
| Spot Facing | Tolerance of depth ±50 microns |
| Heat sink pin | Insert type and Lead free |
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