Capability

Trace/Space
(External)
(um)

Au Plating Resist method

Tenting method

(S)

130/130

(S)
(A)
(LP)

100/100
75/75
50/50

Trace/Space
(Internal)

1/2oz

(S)
(A)
(LP)

100/100
75/75
50/50

1oz

(S)
(A)

125/125
100/100

2oz

(S)
(A)

150/150
125/125

Minimum Via Size
(Finish Size)

D 0.15

Minimum Drill Size(mm)

D 0.2

Drill to Metal

OK

Aspect Ratios

0.8/0.2 = 4  ,1.6/0.3 = 5
1.6/0.2 = 8 (Now Make Improvement)

Buried Vias

OK

Blind Vias

OK

Controlled Depth Drill

(S)
(A)

± 0.05 mm
± 0.03 mm

Laser Type

CO2,YAG

Controlled Impedance

FR-4

50 +- 5ohm

Multi Layer PCB
Max Layer Count

(S)
(A)
(LP)

8
12
20 (Now Make Improvement)

Multi Layer PCB 
Min Core Thickness
                        (mm)

(S)
(LP)

0.1
0.06

Max Thicxkness(mm)

3.2

Selective Soft Gold

OK

Selective Hard Gold

OK

Immersion Au

OK

HAL

OK

Lustrous Ni
(High bright Ni)

OK

Selective Solder Deposition

OK

Carbon ink

OK

Material
     FR-4
     BT
     Polyimide
     High Tg FR-4
     FR-5
     CEM-3
     PPE,PPO

OK
OK
OK
OK
OK
OK
OK

LPI Solder Mask

OK

Soldermask Dam Minimum
                                 (mm)

0.1

Min.Annular Ring

(S)
(A)

Drill Diameter + 0.3 mm
Drill Diameter + 0.2 mm

Rigid-flex/Flex Circuits

OK